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SIP12108ADMP-T1GE4 - Vishay

Description: Conv DC-DC 2.8V to 5.5V Synchronous Step Down Single-Out 0.6V 5A 16-Pin QFN EP

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SIP12108ADMP-T1GE4 - Vishay - PCB symbol
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PCB Footprints
SIP12108ADMP-T1GE4 - Vishay PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN16 3x3_1
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3D Models
SIP12108ADMP-T1GE4 - Vishay - 3D model - Quad Flat No-Lead - QFN16 3x3_1
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SIP12108ADMP-T1GE4 Details

  • Manufacturer Part Number:

    SIP12108ADMP-T1GE4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 4.675V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.8 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-XQCC-N16

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.95 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    4000 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

SIP12108ADMP-T1GE4 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIP12108ADMP-T1GE4 is a 1210-sized pad with a minimum pad size of 2.5mm x 1.25mm and a maximum pad size of 3.5mm x 2.25mm, with a non-solder mask defined (NSMD) pad shape.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 220°C. Also, ensure the PCB is clean and free of oxidation, and use a soldering technique that minimizes thermal shock.
  • The maximum operating temperature range for the SIP12108ADMP-T1GE4 is -55°C to 150°C, with a derating of 1.33 mΩ/°C above 125°C.
  • Yes, the SIP12108ADMP-T1GE4 is suitable for high-frequency applications up to 1 GHz due to its low inductance and high-frequency impedance characteristics.
  • Store the SIP12108ADMP-T1GE4 in its original packaging or in a dry, cool place, away from direct sunlight and moisture. Avoid bending, flexing, or applying excessive mechanical stress to the component during handling and shipping.

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SIP12108ADMP-T1GE4 Overview

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