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SK040NRP - LITTELFUSE

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SK040NRP - LITTELFUSE  - 3D model
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SK040NRP Details

  • Manufacturer Part Number:

    SK040NRP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK

  • Package Description:

    ROHS COMPLIANT, PLASTIC, TO-263, D2PAK-3

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.48

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    250 V/us

  • DC Gate Trigger Current-Max:

    40 mA

  • DC Gate Trigger Voltage-Max:

    1.5 V

  • Holding Current-Max:

    60 mA

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    5 mA

  • Non-Repetitive Pk On-state Cur:

    520 A

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • On-state Current-Max:

    25000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    40 A

  • Repetitive Peak Off-state Voltage:

    1000 V

  • Repetitive Peak Reverse Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

SK040NRP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 20mm x 20mm, and ensuring good thermal conductivity between the pad and the surrounding copper area. Additionally, it's recommended to use a minimum of 2oz copper thickness and to avoid placing any thermal vias under the device.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, ensure good airflow around the device, and consider using a heat sink or thermal interface material to reduce the junction temperature. It's also important to follow proper soldering and assembly techniques to prevent thermal interface resistance.
  • Exceeding the maximum surge current rating can lead to device failure, including thermal runaway, melting of the internal components, or even catastrophic failure. It's essential to ensure that the device is operated within the specified surge current rating to prevent damage and ensure reliable operation.
  • To select the correct fuse for your application, consider the following factors: the maximum available fault current, the nominal operating current, the voltage rating, and the response time required. It's also important to consult the datasheet and application notes to ensure the selected fuse meets the specific requirements of your application.
  • When using the SK040NRP in a high-reliability application, consider the following factors: the device's failure rate, the operating environment, and the required level of redundancy. It's also important to follow proper design and testing procedures, including environmental testing and accelerated life testing, to ensure the device meets the required reliability standards.

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SK040NRP Overview

Use the download button to access the SK040NRP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SK040, or try a keyword search, such as Silicon Controlled Rectifiers

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