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SK26_R2_00001 - PANJIT

Description: Schottky Diodes & Rectifiers SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

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PCB Footprints
SK26_R2_00001 - PANJIT PCB footprint - Diodes Moulded - Diodes Moulded - SMB
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3D Models
SK26_R2_00001 - PANJIT  - 3D model - Diodes Moulded - SMB
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SK26_R2_00001 Details

  • Manufacturer Part Number:

    SK26_R2_00001

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE, PLASTIC, SMB, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    PanJit Semiconductor

  • YTEOL:

    6.07

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    100 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

SK26_R2_00001 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance is to follow the datasheet's guidelines for pinout, decoupling, and thermal management. Additionally, it's recommended to use a 4-layer PCB with a solid ground plane, and to keep the signal traces short and away from noise sources.
  • Thermal management is critical for the SK26_R2_00001. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. The device's thermal pad should be connected to a solid ground plane on the PCB to improve heat dissipation.
  • The recommended operating conditions for the SK26_R2_00001 are: operating temperature range of -40°C to 125°C, supply voltage of 1.8V to 3.6V, and a clock frequency of up to 100 MHz. It's essential to operate the device within these conditions to ensure reliable performance and prevent damage.
  • The SK26_R2_00001's internal registers can be programmed using the device's serial interface (SPI or I2C). The programming sequence and register addresses can be found in the datasheet. It's recommended to use a programming tool or software provided by PanJit Semiconductor or a third-party vendor.
  • The SK26_R2_00001 is typically used in applications such as IoT devices, wearable electronics, and battery-powered devices that require low power consumption and high performance. It's also suitable for use in industrial control systems, medical devices, and consumer electronics.

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SK26_R2_00001 Overview

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