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SK34HE3-TP - MCC

Description: • Halogen Free. "Green" Device (Note 1) • AEC-Q101 Qualified • Lead Free Finish/RoHS Compliant(Note 2) ("P" Suffix Designates Compliant. See Ordering Information) • High Current Capability With Low Forward Voltage • Epoxy Meets UL 94 V-0 Flammability Rating • Moisture Sensitivity Level 1

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PCB Footprints
SK34HE3-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMC (DO-214AB)
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3D Models
SK34HE3-TP - MCC  - 3D model - Diodes Moulded - SMC (DO-214AB)
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SK34HE3-TP Details

  • Manufacturer Part Number:

    SK34HE3-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.12

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SK34HE3-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SK34HE3-TP is a rectangular pad with dimensions of 1.5mm x 0.8mm, with a 0.3mm radius corner and a 0.2mm spacing between pads.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB by using a thermal pad or thermal tape. Also, consider using a heat sink or a thermal interface material to dissipate heat efficiently.
  • The maximum operating temperature range for the SK34HE3-TP is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
  • Yes, the SK34HE3-TP is suitable for high-reliability and automotive applications due to its AEC-Q101 qualification and compliance with automotive industry standards.
  • To ensure reliability in a humid environment, consider using a moisture-resistant coating or conformal coating on the PCB, and ensure that the device is stored in a dry environment before assembly.

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SK34HE3-TP Overview

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