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SKY72300-21 - Skyworks

Description: Fractional N Synthesizer IC 2.1GHz 1 28-TSSOP (0.173", 4.40mm Width) Exposed Pad 2.7V ~ 3.3V -40°C ~ 85°C

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PCB Footprints
SKY72300-21 - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - 28-Pin EP-TSSOP
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3D Models
SKY72300-21 - Skyworks  - 3D model - Small Outline Packages - 28-Pin EP-TSSOP
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SKY72300-21 Details

  • Manufacturer Part Number:

    SKY72300-21

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    9.70 X 6.40 MM, 1.10 MM HEIGHT, ROHS COMPLIANT, TSSOP-28

  • Pin Count:

    28

  • ECCN Code:

    5A991.G

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Skyworks Solutions Inc

  • YTEOL:

    0

  • Additional Feature:

    IT IS ALSO AVAILABLE IN DIVIDE RATIO 32 TO 543 IN INTEGER-N MODE

  • Analog IC - Other Type:

    PLL FREQUENCY SYNTHESIZER

  • JESD-30 Code:

    R-PDSO-G28

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.3 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

SKY72300-21 Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the input and output traces as short as possible, using a solid ground plane, and placing thermal vias under the device. For thermal management, ensure good airflow, use a heat sink if necessary, and follow the recommended thermal resistance guidelines.
  • Use a combination of simulation tools and empirical methods to optimize the input and output matching networks. Consider factors such as frequency, impedance, and power handling. Skyworks provides a reference design and application notes to help with the optimization process.
  • Follow the recommended soldering profile and assembly techniques outlined in the Skyworks application notes. Use a soldering iron with a temperature range of 250°C to 260°C, and ensure the device is handled by trained personnel to prevent damage.
  • Consult the Skyworks troubleshooting guide and application notes for common issues. Check for proper thermal management, ensure correct input and output matching, and verify the device is operated within the recommended specifications.
  • Yes, follow standard ESD precautions when handling the device, such as using an ESD wrist strap, mat, or workstation. Avoid touching the device pins or exposing it to static electricity.

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SKY72300-21 Overview

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