GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH
Packing Method:
TR
Seated Height-Max:
1 mm
Supply Current-Max:
500 mA
Supply Voltage-Nom:
5 V
Surface Mount:
YES
Telecom IC Type:
RF AND BASEBAND CIRCUIT
Terminal Form:
NO LEAD
Terminal Position:
BOTTOM
Width:
3 mm
SKY85747-11 Frequently Asked Questions (FAQs)
A multi-layer PCB with a solid ground plane and a separate layer for the RF signal is recommended. Ensure proper grounding of the device by connecting the exposed pad to the ground plane.
Use a Smith chart or a network analyzer to optimize the matching network. Start with the recommended values in the datasheet and adjust for optimal power transfer and impedance matching.
The device is rated for operation from -40°C to 85°C. However, for reliable operation, it's recommended to operate within a temperature range of 0°C to 70°C to ensure optimal performance and longevity.
Follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device's pins or exposed pads during handling.
Follow the recommended soldering profile in the datasheet, with a peak temperature of 260°C for 10-15 seconds. For rework, use a low-temperature soldering iron and avoid applying excessive heat or force to the device.
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SKY85747-11 Overview
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