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SL12-E3/5AT - Vishay

Description: Schottky Diodes & Rectifiers 20 Volt 1.0 Amp 50 Amp IFSM

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SL12-E3/5AT - Vishay - PCB symbol
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SL12-E3/5AT - Vishay PCB footprint - Diodes Moulded - Diodes Moulded - SL12-E3/5AT
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SL12-E3/5AT - Vishay - 3D model - Diodes Moulded - SL12-E3/5AT
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SL12-E3/5AT Details

  • Manufacturer Part Number:

    SL12-E3/5AT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, SMA, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.1

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.23 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SL12-E3/5AT Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SL12-E3/5AT is a rectangular pad with dimensions of 12.7 mm x 6.35 mm, with a 1.27 mm x 1.27 mm thermal pad in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area around the thermal pad.
  • To ensure proper thermal management, it is recommended to use a thermal interface material (TIM) between the device and the heat sink, and to design the heat sink with a thermal resistance of less than 10°C/W. Additionally, ensure good airflow around the device and heat sink.
  • The maximum allowed voltage derating for the SL12-E3/5AT is 80% of the maximum rated voltage, which is 1200 V for this device. This means the maximum allowed voltage derating is 960 V.
  • While the SL12-E3/5AT is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, the device's performance and losses may degrade at higher frequencies, and additional design considerations may be necessary.
  • To handle the high inrush current during turn-on, it is recommended to use a soft-start circuit or a current limiter to limit the inrush current to a safe value. Additionally, ensure that the power supply and wiring can handle the high inrush current.

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SL12-E3/5AT Overview

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