SLA560BC7T3F footprint, schematic symbol and 3D model by ROHM Semiconductor

Symbol

PCB Footprints

3D Models

SLA560BC7T3F Details

A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a thermal relief pattern is suggested to improve heat dissipation.
Use a capacitor with an ESR of 10 ohms or less, and add a 1-10nF ceramic capacitor in parallel to the output capacitor to improve stability.
The maximum allowed voltage on the EN pin is 6V, exceeding which may cause damage to the IC.
The IC is rated for operation up to 125°C, but derating is required above 85°C. Ensure proper thermal design and consider using a heat sink if necessary.
Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and add a common-mode choke or EMI filter to reduce emissions.

Manufacturer Collaborated

System Verified

Community Approved

Use the download button to access the SLA560BC7T3F schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like SLA56, or try a keyword search, such as Visible LEDs

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →