SLA560EC4T3F footprint, schematic symbol and 3D model by ROHM Semiconductor

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SLA560EC4T3F Details

A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a thermal relief pattern is suggested to improve heat dissipation.
Use a stable input voltage, ensure proper PCB layout, and follow the recommended operating conditions to ensure stable operation over the entire operating temperature range of -40°C to 125°C.
The maximum allowed voltage on the input pins is 6V, exceeding which may cause damage to the device.
Use ESD protection devices such as TVS diodes or ESD arrays on the input lines, and follow proper handling and storage procedures to prevent ESD damage.
Store the device in a dry, cool place, away from direct sunlight, and avoid exposing it to moisture, extreme temperatures, or physical stress.

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