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SLD8S24A - LITTELFUSE

Description: ESD Suppressors / TVS Diodes 24V 7kW UNI-DIR SLD8S AEC-Q101

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PCB Footprints
SLD8S24A - LITTELFUSE PCB footprint - Other - Other - SLD8S24A-3
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SLD8S24A - LITTELFUSE  - 3D model - Other - SLD8S24A-3
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SLD8S24A Details

  • Manufacturer Part Number:

    SLD8S24A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2016-08-24

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.06

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    29.5 V

  • Breakdown Voltage-Min:

    26.7 V

  • Breakdown Voltage-Nom:

    28.1 V

  • Clamping Voltage-Max:

    38.9 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JESD-30 Code:

    R-PSSO-C1

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    7000 W

  • Number of Elements:

    1

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    8 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

SLD8S24A Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • Use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the thermal pad and reflow at 240°C to 250°C for 30-60 seconds.
  • The device can withstand a maximum surge current of 100 A for 10 ms, but this may vary depending on the application and environmental conditions.
  • The device is rated for operation up to 150°C, but derating is required above 125°C. Consult the datasheet for specific derating curves.
  • Choose a fuse rating that is 1.5 to 2 times the maximum expected current in the circuit. Consider factors like inrush current, steady-state current, and fault current when selecting the fuse rating.

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SLD8S24A Overview

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