SM2835UWDW02 footprint, schematic symbol and 3D model by Bivar

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SM2835UWDW02 Details

Bivar recommends a PCB layout with a solid ground plane and thermal vias under the device to improve heat dissipation. A minimum of 2 oz copper thickness is recommended.
Bivar recommends using a soldering temperature of 260°C (500°F) with a dwell time of 3-5 seconds. A soldering iron with a fine tip and a solder with a low melting point (e.g., Sn96.5Ag3Cu0.5) is recommended.
The SM2835UWDW02 is rated for operation from -40°C to 85°C (-40°F to 185°F). However, the device's performance may degrade at extreme temperatures, and derating may be necessary.
The SM2835UWDW02 is not hermetically sealed, so it's not recommended for use in high-humidity environments. If exposure to moisture is unavoidable, consider using a conformal coating or potting the device to protect it.
Bivar recommends storing the SM2835UWDW02 in a dry, cool place with a relative humidity of 60% or less. Avoid storing the device in direct sunlight or near heat sources.

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