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SM30T23AY - STMicroelectronics

Description: Automotive 3000 W TVS in SMC

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SM30T23AY - STMicroelectronics PCB footprint - Other - Other - SM30TxxAY
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SM30T23AY - STMicroelectronics  - 3D model - Other - SM30TxxAY
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SM30T23AY Details

  • Manufacturer Part Number:

    SM30T23AY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Additional Feature:

    MIL-STD-750

  • Breakdown Voltage-Max:

    24.6 V

  • Breakdown Voltage-Min:

    22.2 V

  • Breakdown Voltage-Nom:

    23.4 V

  • Clamping Voltage-Max:

    32.4 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4; ISO 7637-2

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SM30T23AY Frequently Asked Questions (FAQs)

  • A good layout should ensure that the thermal pad is connected to a large copper area, and vias should be used to dissipate heat to the bottom layer. A 2-3 layer board with a solid ground plane is recommended.
  • Ensure proper heat sinking, use a thermally conductive interface material, and consider derating the device's power handling at high temperatures. Also, follow the recommended operating conditions and thermal management guidelines.
  • Use a shielded enclosure, ensure proper grounding, and follow best practices for PCB layout and component placement. Additionally, consider using EMI filters and shielding components to minimize radiation.
  • Choose a gate driver that can provide the required peak current, has a suitable rise and fall time, and is compatible with the device's voltage and current ratings. Consider factors like propagation delay, input capacitance, and output impedance.
  • Monitor the device's temperature, voltage, and current to ensure safe operation. Also, keep an eye on the gate-source voltage, drain-source voltage, and drain current to prevent overvoltage, overcurrent, and overheating.

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SM30T23AY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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