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SM30T26CAY - STMicroelectronics

Description: STMicroelectronics SM30T26CAY, Bi-Directional TVS Diode, 3000W, 2-Pin DO-214AB

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Symbol
SM30T26CAY - STMicroelectronics - PCB symbol
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PCB Footprints
SM30T26CAY - STMicroelectronics PCB footprint - Other - Other - SMC_BD
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3D Models
SM30T26CAY - STMicroelectronics - 3D model - Other - SMC_BD
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SM30T26CAY Details

  • Manufacturer Part Number:

    SM30T26CAY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Additional Feature:

    MIL-STD-750

  • Breakdown Voltage-Max:

    27 V

  • Breakdown Voltage-Min:

    24.4 V

  • Breakdown Voltage-Nom:

    25.7 V

  • Clamping Voltage-Max:

    35.5 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4; ISO 7637-2

  • Rep Pk Reverse Voltage-Max:

    22 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    22 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

SM30T26CAY Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • The recommended soldering conditions for the SM30T26CAY are: peak temperature of 260°C, soldering time of 10-30 seconds, and a maximum of 2 reflows. It's essential to follow the recommended soldering profile to prevent damage to the device.
  • To protect the device from ESD, it's essential to follow proper handling and storage procedures, such as using ESD-safe materials, grounding oneself before handling the device, and storing the device in an ESD-safe environment.
  • The recommended decoupling capacitor values are 10nF to 100nF, and they should be placed as close to the device's power pins as possible. The capacitors should be rated for the device's operating voltage and should be placed on the same PCB layer as the device.

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SM30T26CAY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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