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SM36-TP - MCC

Description: For Sensitive ESD Protection • Low Leakage • Fast Response Time • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Halogen Free. “Green” Device (Note 1) • Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS Compliant. See Ordering Information)

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Symbol
SM36-TP - MCC - PCB symbol
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PCB Footprints
SM36-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - sot-23 d
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3D Models
SM36-TP - MCC - 3D model - SOT23 (3-Pin) - sot-23 d
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SM36-TP Details

  • Manufacturer Part Number:

    SM36-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    60 V

  • Breakdown Voltage-Min:

    40 V

  • Case Connection:

    ISOLATED

  • Clamping Voltage-Max:

    80 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    240 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    36 V

  • Reverse Current-Max:

    1 µA

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SM36-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, connecting it to a copper plane on the PCB, and using thermal vias to dissipate heat to the top layer. A minimum of 2-3 thermal vias with a diameter of 0.3-0.5mm is recommended.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device's power dissipation. Additionally, ensure that the PCB is designed with high-temperature-rated components and materials, and that the device is mounted using a reliable thermal interface material.
  • The recommended soldering profile for the SM36-TP involves a peak temperature of 260°C (500°F) with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to minimize oxidation.
  • The SM36-TP is a moisture-sensitive device and should be stored in a dry environment with a relative humidity of less than 30%. Before soldering, the device should be baked in a dry environment at 125°C (257°F) for 24 hours to remove any moisture that may have been absorbed during storage.
  • The recommended electrical connection sequence for the SM36-TP involves connecting the ground pin first, followed by the input and output pins. This sequence helps to prevent electrical overstress and damage to the device.

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SM36-TP Overview

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