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SM4007PLHE3-TP - MCC

Description: Diode 1000 V 1A Surface Mount SOD-123FL

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Symbol
SM4007PLHE3-TP - MCC - PCB symbol
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PCB Footprints
SM4007PLHE3-TP - MCC PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL_2023
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3D Models
SM4007PLHE3-TP - MCC - 3D model - Small Outline Diode Flat Lead - SOD-123FL_2023
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SM4007PLHE3-TP Details

  • Manufacturer Part Number:

    SM4007PLHE3-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    3 µs

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    10

SM4007PLHE3-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SM4007PLHE3-TP is a 4-pin SOT23 package with a 1.3mm x 1.3mm body size and a 0.5mm pitch.
  • To ensure reliability in high-temperature applications, it is recommended to follow proper PCB design and layout guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range.
  • The maximum allowed voltage on the input pins of the SM4007PLHE3-TP is 6V, exceeding which may cause damage to the device.
  • Yes, the SM4007PLHE3-TP is AEC-Q100 qualified, making it suitable for use in automotive applications.
  • To troubleshoot issues with the SM4007PLHE3-TP, check the device's pinout and connections, ensure proper power supply and input signals, and verify that the device is operated within its specified parameters.

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SM4007PLHE3-TP Overview

Use the download button to access the SM4007PLHE3-TP schematic symbol, PCB footprint, and 3D model.
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