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SMAJ45Ae3/TR13 - Microchip

Description: 72.7V Clamp 6.9A Ipp Tvs Diode Surface Mount DO-214AC (SMA)

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PCB Footprints
SMAJ45Ae3/TR13 - Microchip PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AC (SMA)
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3D Models
SMAJ45Ae3/TR13 - Microchip  - 3D model - Diodes Moulded - DO-214AC (SMA)
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SMAJ45Ae3/TR13 Details

  • Manufacturer Part Number:

    SMAJ45AE3/TR13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Breakdown Voltage-Max:

    55.3 V

  • Breakdown Voltage-Min:

    50 V

  • Breakdown Voltage-Nom:

    52.65 V

  • Clamping Voltage-Max:

    72.7 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

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SMAJ45Ae3/TR13 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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