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SMAJ5919B-TP - MCC

Description: VZ – Tolerance: ±5% • For Surface Mount Applications • Halogen Free. “Green” Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant (Note2) ("P" Suffix Designates RoHS Compliant. See Ordering Information)

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Symbol
SMAJ5919B-TP - MCC - PCB symbol
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PCB Footprints
SMAJ5919B-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AC
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3D Models
SMAJ5919B-TP - MCC - 3D model - Diodes Moulded - DO-214AC
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SMAJ5919B-TP Details

  • Manufacturer Part Number:

    SMAJ5919B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AC

  • Package Description:

    SMAJ, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    2 Ω

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    250 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    5.6 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    66.9 mA

SMAJ5919B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for SMAJ5919B-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To ensure reliability in high-temperature applications, it's crucial to follow the recommended derating curves and thermal management guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
  • The maximum allowable voltage transients for SMAJ5919B-TP are not explicitly stated in the datasheet. However, as a general rule, it's recommended to limit voltage transients to 10% of the rated standoff voltage to prevent damage to the device.
  • While it's technically possible to use multiple SMAJ5919B-TP devices in parallel, it's not recommended as it can lead to uneven current sharing and reduced reliability. Instead, consider using a single device with a higher power rating or consulting with a Micro Commercial Components' application engineer for a custom solution.
  • The typical response time of SMAJ5919B-TP to a surge event is in the range of nanoseconds. However, the exact response time may vary depending on the specific application and surge characteristics. Consult with a Micro Commercial Components' application engineer for more information.

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SMAJ5919B-TP Overview

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