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SMBJ100A - Taiwan Semiconductor

Description: ESD Suppressors / TVS Diodes 600 Watt TVSs

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SMBJ100A - Taiwan Semiconductor - PCB symbol
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PCB Footprints
SMBJ100A - Taiwan Semiconductor PCB footprint - Diodes Moulded - Diodes Moulded - SMBJ100A
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SMBJ100A - Taiwan Semiconductor - 3D model - Diodes Moulded - SMBJ100A
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SMBJ100A Details

  • Manufacturer Part Number:

    SMBJ100A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    123 V

  • Breakdown Voltage-Min:

    111 V

  • Breakdown Voltage-Nom:

    117 V

  • Clamping Voltage-Max:

    162 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMBJ100A Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for SMBJ100A can be found in the Taiwan Semiconductor's application note or in IPC-7351 standard. A minimum pad size of 0.8mm x 0.8mm with a 0.2mm solder mask clearance is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a reflow oven or a soldering iron with a soldering tip size of 1.5mm to 2.5mm to solder the device. Avoid overheating or applying excessive force, which can damage the device.
  • The maximum operating temperature range for SMBJ100A is -55°C to 150°C. However, the device's performance and reliability may degrade if operated at temperatures above 125°C for an extended period.
  • Yes, SMBJ100A can be used in high-frequency circuits up to 1 GHz. However, the device's parasitic capacitance and inductance may affect the circuit's performance. It's recommended to use a simulation tool or consult with a Taiwan Semiconductor's application engineer to ensure the device's suitability for high-frequency applications.
  • To ensure ESD protection, handle the SMBJ100A devices with an ESD wrist strap or mat, and store them in an ESD-protected environment. Avoid touching the device's pins or leads, and use ESD-protected packaging and shipping materials.

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SMBJ100A Overview

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SMBJ100A Alternates

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Part Image MASMBJ100AE3TR Microsemi Corporation (now Microchip)

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Part Image SMBJ100-TP Micro Commercial Components

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For a full list of alternate parts for SMBJ100A, check out Findchips.com