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SMBJ180CA-H - Bourns

Description: ESD Suppressors / TVS Diodes 180volts 1uA 2.1 Amps Bi-Dir

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SMBJ180CA-H - Bourns - PCB symbol
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PCB Footprints
SMBJ180CA-H - Bourns PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - SMB (DO-214AA
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3D Models
SMBJ180CA-H - Bourns - 3D model - Diodes Moulded Non Polarised - SMB (DO-214AA
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SMBJ180CA-H Details

  • Manufacturer Part Number:

    SMBJ180CA-H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.9

  • Additional Feature:

    PRSM-MIN

  • Breakdown Voltage-Max:

    222 V

  • Breakdown Voltage-Min:

    201 V

  • Breakdown Voltage-Nom:

    211.5 V

  • Clamping Voltage-Max:

    292 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    180 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMBJ180CA-H Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SMBJ180CA-H is a standard SMB (DO-214AA) footprint with a pad size of 2.5 mm x 1.5 mm and a spacing of 1.3 mm between pads.
  • While the SMBJ180CA-H is rated for operation up to 150°C, it's recommended to derate the device's power handling capability at high temperatures. Consult the datasheet for derating curves and consult with a Bourns application engineer for specific guidance.
  • To ensure reliable soldering, follow the recommended soldering profile: peak temperature of 260°C, dwell time of 10-15 seconds, and a soldering iron with a tip temperature of 350°C. Also, use a solder with a melting point of 220°C or higher.
  • Yes, SMBJ180CA-H is compatible with lead-free soldering processes. However, the recommended soldering profile may need to be adjusted to accommodate the higher melting point of lead-free solders.
  • While the SMBJ180CA-H is not hermetically sealed, it is designed to withstand normal humidity levels. However, in high-humidity environments, consider using a conformal coating or potting compound to protect the device from moisture ingress.

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SMBJ180CA-H Overview

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