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SMBJ6.0CA-Q - Bourns

Description: SMBJ-Q Transient Voltage Suppressor Diode Series, Bi-Directional

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PCB Footprints
SMBJ6.0CA-Q - Bourns PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - SMB (DO-214AA)
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3D Models
SMBJ6.0CA-Q - Bourns  - 3D model - Diodes Moulded Non Polarised - SMB (DO-214AA)
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SMBJ6.0CA-Q Details

  • Manufacturer Part Number:

    SMBJ6.0CA-Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.2

  • Additional Feature:

    PRSM-MIN

  • Breakdown Voltage-Max:

    7.37 V

  • Breakdown Voltage-Min:

    6.67 V

  • Breakdown Voltage-Nom:

    7.02 V

  • Clamping Voltage-Max:

    10.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    6 V

  • Reverse Current-Max:

    800 µA

  • Reverse Test Voltage:

    6 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMBJ6.0CA-Q Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMBJ6.0CA-Q is a rectangular pad with a minimum size of 1.5 mm x 0.8 mm, with a 0.5 mm x 0.5 mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined (NSMD) pad for the thermal pad.
  • The thermal pad on the SMBJ6.0CA-Q should be connected to a copper plane on the PCB to dissipate heat. The copper plane should be at least 1 oz (35 μm) thick and should not be solder-masked. A thermal via array can also be used to improve heat dissipation.
  • The maximum operating temperature of the SMBJ6.0CA-Q is 150°C, with a derating of 1.33 V/°C above 25°C. The device should not be operated above 150°C for extended periods to prevent damage.
  • The voltage rating of the SMBJ6.0CA-Q should be selected based on the maximum voltage expected in the application. The device is available in voltage ratings from 5 V to 170 V. A minimum of 10% margin should be added to the maximum expected voltage to ensure reliable operation.
  • The response time of the SMBJ6.0CA-Q is typically less than 1 ns, making it suitable for high-speed applications such as data lines and I/O interfaces.

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SMBJ6.0CA-Q Overview

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