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SMBJP6KE30A-TP - MCC

Description: TVS DIODE 25.6VWM 41.4VC DO214AA

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PCB Footprints
SMBJP6KE30A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMB (DO-214AA)
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3D Models
SMBJP6KE30A-TP - MCC  - 3D model - Diodes Moulded - SMB (DO-214AA)
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SMBJP6KE30A-TP Details

  • Manufacturer Part Number:

    SMBJP6KE30A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    31.5 V

  • Breakdown Voltage-Min:

    28.5 V

  • Breakdown Voltage-Nom:

    30 V

  • Clamping Voltage-Max:

    41.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    25.6 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMBJP6KE30A-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SMBJP6KE30A-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure proper soldering and to prevent thermal issues.
  • To ensure proper soldering, follow the recommended soldering profile, use a solder with a melting point below 220°C, and avoid overheating the component. Also, ensure the PCB is clean and free of oxidation to promote good solder wetting.
  • The maximum allowable voltage derating for the SMBJP6KE30A-TP is typically 10-15% below the maximum rated voltage. However, it's recommended to consult the datasheet or contact Micro Commercial Components for specific guidance on voltage derating.
  • The SMBJP6KE30A-TP is rated for operation up to 150°C. However, it's essential to consider the device's power dissipation, thermal resistance, and PCB design to ensure reliable operation in high-temperature environments.
  • To prevent ESD damage, handle the SMBJP6KE30A-TP with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure the workspace is ESD-safe, and follow proper handling and storage procedures.

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SMBJP6KE30A-TP Overview

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