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SMC30J33CA - STMicroelectronics

Description: 3000 W, 33 V TVS in SMC

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SMC30J33CA - STMicroelectronics PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - smc-ren1
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SMC30J33CA - STMicroelectronics  - 3D model - Diodes Moulded Non Polarised - smc-ren1
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SMC30J33CA Details

  • Manufacturer Part Number:

    SMC30J33CA

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Breakdown Voltage-Max:

    40.5 V

  • Breakdown Voltage-Min:

    36.7 V

  • Breakdown Voltage-Nom:

    38.6 V

  • Clamping Voltage-Max:

    53.3 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5; MIL-STD-750

  • Rep Pk Reverse Voltage-Max:

    33 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    33 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

SMC30J33CA Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the SMC30J33CA near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB traces away from the thermal pad.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within its specified temperature range (up to 150°C for the SMC30J33CA). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature (TJ) and adjust the thermal design accordingly.
  • Handle the SMC30J33CA by the body, not the leads, to prevent damage. Store the device in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and use anti-static packaging and handling procedures to prevent electrostatic discharge (ESD) damage.
  • Select a heat sink with a thermal resistance (Rth) that is compatible with the device's power dissipation requirements. Consider the device's maximum power dissipation, the ambient temperature, and the desired junction temperature (TJ) when selecting a heat sink. A heat sink with a thermal resistance of 10-20°C/W is typically suitable for the SMC30J33CA.
  • When operating multiple SMC30J33CA devices in parallel, ensure that each device has its own heat sink and thermal interface material (TIM). Use a common bus or track for the drain connections, and consider using a current-sharing technique to ensure equal current distribution among the devices.

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SMC30J33CA Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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