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SMDA05C.TBT - SEMTECH

Description: SEMTECH - SMDA05C.TBT - TVS Diode, SMDAC Series, Bidirectional, 5 V, 11 V, SOIC, 8 Pins

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PCB Footprints
SMDA05C.TBT - SEMTECH PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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SMDA05C.TBT - SEMTECH  - 3D model - Small Outline Packages - SO-8
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SMDA05C.TBT Details

  • Manufacturer Part Number:

    SMDA05C.TBT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    LEAD FREE, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Semtech Corporation

  • YTEOL:

    6.46

  • Additional Feature:

    HIGH RELIABILITY, LOW LEAKAGE CURRENT

  • Breakdown Voltage-Min:

    6 V

  • Clamping Voltage-Max:

    9.8 V

  • Configuration:

    COMMON BIPOLAR TERMINAL, 8 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    8

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

SMDA05C.TBT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. A thermal pad on the bottom of the device should be connected to a solid ground plane or a thermal relief pattern.
  • Use a shielded enclosure, ensure proper grounding, and follow good PCB layout practices. Add EMI filters or ferrite beads on input/output lines if necessary. Comply with relevant EMC standards and regulations.
  • Handle the device by the body, avoiding touching the pins. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow ESD precautions during handling and assembly.
  • Use a logic analyzer or oscilloscope to monitor signals. Check power supply voltage, decoupling, and signal integrity. Verify correct pin connections and signal routing. Consult the datasheet and application notes for troubleshooting guidelines.
  • The device is designed for high reliability and long lifespan. Follow proper handling, storage, and operating conditions to ensure a typical lifespan of 10-15 years or more, depending on the application and environmental factors.

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SMDA05C.TBT Overview

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