The recommended land pattern for SMDIC04100TB00KQ00 is a rectangular pad with a size of 4.5mm x 2.5mm, with a solder mask clearance of 0.2mm around the pad.
Handle the component by the edges or the body, avoiding touching the electrodes or the ceramic surface to prevent damage or contamination. Use anti-static precautions and avoid bending or flexing the component.
The maximum temperature rating for soldering SMDIC04100TB00KQ00 is 260°C for a maximum of 10 seconds, with a peak temperature of 240°C.
While SMDIC04100TB00KQ00 is designed to operate in a wide range of temperatures, it is not recommended for use in humid environments. If used in humid environments, the component may be susceptible to moisture ingress and reduced reliability.
Store SMDIC04100TB00KQ00 components in their original packaging, in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the components to extreme temperatures, humidity, or physical stress.
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SMDIC04100TB00KQ00 Overview
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