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SMDJ70A - LITTELFUSE

Description: 113V Clamp 26.5A Ipp Tvs Diode Surface Mount DO-214AB (SMCJ)

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PCB Footprints
SMDJ70A - LITTELFUSE PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AB (SMC J-Bend)_2025-1
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3D Models
SMDJ70A - LITTELFUSE  - 3D model - Diodes Moulded - DO-214AB (SMC J-Bend)_2025-1
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SMDJ70A Details

  • Manufacturer Part Number:

    SMDJ70A

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    86 V

  • Breakdown Voltage-Min:

    77.8 V

  • Breakdown Voltage-Nom:

    81.9 V

  • Clamping Voltage-Max:

    113 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    6.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2, 4-4; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SMDJ70A Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SMDJ70A is a rectangular pad with a minimum size of 2.5mm x 1.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a solder mask defined gap of 0.2mm.
  • To ensure reliable soldering of the SMDJ70A, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a reflow oven with a peak temperature of 240°C to 250°C, and a dwell time of 30-60 seconds.
  • The maximum operating temperature of the SMDJ70A is 150°C, with a derating of 1.33V/°C above 25°C.
  • Yes, the SMDJ70A is suitable for high-reliability applications, including aerospace, defense, and medical devices, due to its high surge capability and low clamping voltage.
  • The SMDJ70A is designed to withstand ESD events up to 30kV, and can respond to ESD pulses with a rise time of 1ns and a pulse width of 100ns.

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