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SMF18AT1G - onsemi

Description: 200 W Transient Voltage Suppressor SOD-123 Flat Lead Package

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SMF18AT1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL CASE498
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SMF18AT1G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-123FL CASE498
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SMF18AT1G Details

  • Manufacturer Part Number:

    SMF18AT1G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    SOD

  • Package Description:

    ROHS COMPLIANT, PLASTIC, CASE 498, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    498-01

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW ZENER IMPEDANCE

  • Breakdown Voltage-Max:

    71.2 V

  • Breakdown Voltage-Min:

    64.4 V

  • Breakdown Voltage-Nom:

    21 V

  • Clamping Voltage-Max:

    29.2 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.385 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    58 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMF18AT1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SMF18AT1G is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.5 mm radius corner. The pad should be centered on the component and have a solder mask defined (SMD) pad shape.
  • The thermal pad of SMF18AT1G should be connected to a large copper area on the PCB to dissipate heat efficiently. A thermal via array or a solid copper pour can be used to connect the thermal pad to the copper area.
  • The maximum operating temperature range for SMF18AT1G is -40°C to 150°C. However, the device is typically specified for operation up to 125°C, and derating is required for operation above 125°C.
  • To ensure the reliability of SMF18AT1G in high-reliability applications, follow the recommended storage and handling procedures, use a clean and dry assembly process, and perform thorough inspection and testing of the assembled boards.
  • Yes, SMF18AT1G is AEC-Q101 qualified, which means it meets the stringent requirements for automotive applications. However, it's essential to follow the recommended operating conditions and ensure that the device is used within its specified ratings.

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SMF18AT1G Overview

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