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SMF24VTFTR - ROHM Semiconductor

Description: Transient Voltage Suppressor (AEC-Q101 Qualified)

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Symbol
SMF24VTFTR - ROHM Semiconductor - PCB symbol
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PCB Footprints
SMF24VTFTR - ROHM Semiconductor PCB footprint - Other - Other - PMDU_2022-15
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3D Models
SMF24VTFTR - ROHM Semiconductor - 3D model - Other - PMDU_2022-15
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SMF24VTFTR Details

  • Manufacturer Part Number:

    SMF24VTFTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-109B, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2017-05-08

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Min:

    26.7 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    200 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMF24VTFTR Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMF24VTFTR is a rectangular pad with a size of 1.2mm x 0.8mm, with a solder mask opening of 0.8mm x 0.5mm. This ensures proper soldering and minimizes the risk of solder bridging.
  • The thermal pad of SMF24VTFTR should be connected to a copper plane on the PCB to ensure efficient heat dissipation. A thermal via or a thermal relief pattern can be used to connect the thermal pad to the copper plane.
  • The maximum operating temperature range for SMF24VTFTR is -40°C to 150°C. However, the device can withstand a maximum junction temperature of 175°C for a short duration.
  • To ensure the reliability of SMF24VTFTR in high-humidity environments, it is recommended to apply a conformal coating to the PCB and ensure that the device is stored in a dry environment before assembly. Additionally, the device should be soldered using a reflow soldering process to minimize the risk of moisture ingress.
  • The recommended storage condition for SMF24VTFTR is in a dry environment with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. The device should be stored in its original packaging or in a sealed bag to prevent moisture ingress.

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SMF24VTFTR Overview

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