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SMF30AT1G - onsemi

Description: 200 W Transient Voltage Suppressor SOD-123 Flat Lead Package

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Symbol
SMF30AT1G - onsemi - PCB symbol
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PCB Footprints
SMF30AT1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL CASE498
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3D Models
SMF30AT1G - onsemi - 3D model - Small Outline Diode Flat Lead - SOD-123FL CASE498
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SMF30AT1G Details

  • Manufacturer Part Number:

    SMF30AT1G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    SOD

  • Package Description:

    ROHS COMPLIANT, PLASTIC, CASE 498, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    498-01

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, LOW ZENER IMPEDANCE

  • Breakdown Voltage-Max:

    36.8 V

  • Breakdown Voltage-Min:

    33.3 V

  • Breakdown Voltage-Nom:

    35.1 V

  • Clamping Voltage-Max:

    48.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.385 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMF30AT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to a solid copper plane on the bottom layer.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below 125°C. Monitor the device's thermal resistance (RθJA) and adjust the system design accordingly.
  • The SMF30AT1G has an integrated ESD protection diode, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
  • Yes, the SMF30AT1G is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard and is PPAP (Production Part Approval Process) capable. However, additional testing and validation may be required for specific applications.
  • The optimal gate resistor value depends on the specific application and switching frequency. A general guideline is to use a value between 10Ω and 100Ω. A higher value can reduce EMI, but may increase switching losses. Consult the application note or onsemi's support team for more guidance.

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SMF30AT1G Overview

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