Bivar recommends a thermal pad on the bottom of the device, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Bivar recommends using a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 180°C to 190°C. Avoid using excessive solder or flux, and ensure the PCB is clean and dry.
The maximum allowable voltage drop across the SMFLP10.0 is 2.5V. Exceeding this voltage drop may lead to reduced performance, increased heat generation, or even device failure.
While the SMFLP10.0 is designed to operate in a wide range of temperatures, it's not recommended for use in high-humidity environments (>80% RH) without proper protection. Consider using a conformal coating or potting compound to prevent moisture ingress.
Bivar recommends storing the SMFLP10.0 in a dry, cool place (<30°C, <60% RH) away from direct sunlight and moisture. Avoid storing the devices in close proximity to strong electromagnetic fields or radiation sources.
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SMFLP10.0 Overview
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