SMLE13WBC8W1 footprint, schematic symbol and 3D model by ROHM Semiconductor

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SMLE13WBC8W1 Details

A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the bottom layer of the PCB.
To ensure reliable operation at high temperatures, it is recommended to follow the recommended operating conditions, use a heat sink if necessary, and ensure good thermal design and layout on the PCB.
The maximum allowable voltage for the input pins is the same as the maximum supply voltage, which is 6.5V according to the datasheet.
The SMLE13WBC8W1 is not specifically designed for high-humidity environments, but it can still be used with proper precautions such as conformal coating and sealing to prevent moisture ingress.
To troubleshoot issues with the device not turning on, check the power supply voltage, ensure proper connections, and verify that the enable pin is properly configured.

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Use the download button to access the SMLE13WBC8W1 schematic symbol, PCB footprint, and 3D model.

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