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SMLJ60S10-TP - MCC

Description: Standard Recovery Rectifiers

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PCB Footprints
SMLJ60S10-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMC (DO-214AB) (LEAD FRAME)-1
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3D Models
SMLJ60S10-TP - MCC  - 3D model - Diodes Moulded - SMC (DO-214AB) (LEAD FRAME)-1
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SMLJ60S10-TP Details

  • Manufacturer Part Number:

    SMLJ60S10-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMLJ60S10-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMLJ60S10-TP is a rectangular pad with a size of 2.5mm x 1.5mm, with a solder mask clearance of 0.2mm around the pad.
  • Yes, SMLJ60S10-TP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
  • To prevent ESD damage, handle SMLJ60S10-TP with an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device's pins or leads with bare hands.
  • Store SMLJ60S10-TP in a dry, cool place with a temperature range of 10°C to 30°C and humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
  • Yes, SMLJ60S10-TP is compatible with lead-free soldering processes. However, ensure that the soldering temperature and time are within the recommended specifications to prevent damage to the device.

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SMLJ60S10-TP Overview

Use the download button to access the SMLJ60S10-TP schematic symbol, PCB footprint, and 3D model.
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