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SMMSD103T1G - onsemi

Description: Pb-Free Package is Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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SMMSD103T1G - onsemi - PCB symbol
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PCB Footprints
SMMSD103T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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SMMSD103T1G - onsemi - 3D model - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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SMMSD103T1G Details

  • Manufacturer Part Number:

    SMMSD103T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.12

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.625 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.4 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    250 V

  • Reverse Recovery Time-Max:

    0.05 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMMSD103T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a thermal relief pattern.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below the maximum rating. Monitor the device's thermal resistance (RθJA) and ensure it is within the specified range.
  • The SMMSD103T1G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protective package when not in use.
  • Yes, the SMMSD103T1G is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard for automotive applications and is suitable for use in harsh environments.
  • Use a systematic approach to troubleshoot issues. Check the device's pinout and ensure correct connections. Verify the power supply voltage and current ratings. Use oscilloscopes or logic analyzers to monitor signal waveforms and identify potential issues. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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SMMSD103T1G Overview

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