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SMMSD701T1G - onsemi

Description: Extremely Low Minority Carrier Lifetime; Low Reverse Leakage; Very Low Capacitance; Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

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SMMSD701T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123 CASE 425-04 ISSUE G
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SMMSD701T1G - onsemi  - 3D model - Small Outline Diode - SOD-123 CASE 425-04 ISSUE G
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SMMSD701T1G Details

  • Manufacturer Part Number:

    SMMSD701T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Breakdown Voltage-Min:

    70 V

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    1 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • Frequency Band:

    ULTRA HIGH FREQUENCY

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    AEC-Q101

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    35 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMMSD701T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage can cause permanent damage.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the device from electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.
  • Power up the device in the following sequence: VCC, then VIN, and finally the input signals. This ensures proper device initialization and prevents latch-up or damage.

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SMMSD701T1G Overview

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