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SMP100LC-25 - STMicroelectronics

Description: TRIAC SMP100LC-25, 25V, DO-214AA 2-Pin 25V Off-State 400 A Ipp TVS Thyristor DO-214AA, SMB

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SMP100LC-25 - STMicroelectronics - PCB symbol
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SMP100LC-25 - STMicroelectronics PCB footprint - Other - Other - SMP100LC-25
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SMP100LC-25 Details

  • Manufacturer Part Number:

    SMP100LC-25

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Breakover Voltage-Max:

    35 V

  • Configuration:

    SINGLE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-Repetitive Pk On-state Cur:

    24 A

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Repetitive Peak Reverse Voltage:

    25 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Device Type:

    THYRISTOR SURGE PROTECTOR

SMP100LC-25 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the SMP100LC-25 near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB traces away from the thermal pad.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices. This includes providing adequate heat sinking, using a thermal interface material (TIM) between the device and the heat sink, and ensuring good airflow around the device. Additionally, consider using a thermally-enhanced package or a heat spreader to reduce the thermal resistance.
  • The recommended soldering conditions for the SMP100LC-25 involve using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3 to 5 seconds. The device should be soldered using a no-clean or water-soluble flux, and the soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • During storage and shipping, the SMP100LC-25 should be handled with care to prevent mechanical stress and electrostatic discharge (ESD). The device should be stored in its original packaging or in a protective container, and should be handled using ESD-safe materials and tools. Avoid bending, flexing, or dropping the device, and ensure that it is not exposed to extreme temperatures or humidity.
  • The SMP100LC-25 is manufactured according to STMicroelectronics' quality and reliability standards, which include compliance with international standards such as IEC, JEDEC, and AEC. The device is also subject to rigorous testing and inspection procedures to ensure its reliability and performance.

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SMP100LC-25 Overview

Use the download button to access the SMP100LC-25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SMP10, or try a keyword search, such as Silicon Surge Protectors

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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