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SMP100LC-35 - STMicroelectronics

Description: Telecom transient arrestor,SMP100LC-35 STMicroelectronics 35V 100A SMB Telecom Transient Arrestor

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PCB Footprints
SMP100LC-35 - STMicroelectronics PCB footprint - Other - Other - SMB (JEDEC DO-214AA)_2024-9
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3D Models
SMP100LC-35 - STMicroelectronics  - 3D model - Other - SMB (JEDEC DO-214AA)_2024-9
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SMP100LC-35 Details

  • Manufacturer Part Number:

    SMP100LC-35

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Breakover Voltage-Max:

    55 V

  • Configuration:

    SINGLE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-Repetitive Pk On-state Cur:

    24 A

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Repetitive Peak Reverse Voltage:

    35 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Device Type:

    THYRISTOR SURGE PROTECTOR

SMP100LC-35 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the SMP100LC-35 near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB traces away from the thermal pad.
  • To ensure reliable operation at high temperatures, ensure that the SMP100LC-35 is operated within its specified temperature range (-40°C to 150°C). Use a heat sink or thermal pad to dissipate heat, and avoid overheating the device. Also, ensure that the PCB is designed to withstand high temperatures, and that the device is properly soldered to the PCB.
  • When handling the SMP100LC-35, take precautions to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat, and handle the device by the body or pins, not the leads. Avoid touching the device's pins or leads, and store the device in an anti-static bag or container.
  • To troubleshoot issues with the SMP100LC-35, start by checking the device's pinout and ensuring that it is properly soldered to the PCB. Verify that the device is operated within its specified voltage and temperature ranges. Use a multimeter to check for voltage and current levels, and an oscilloscope to check for signal integrity. Consult the datasheet and application notes for troubleshooting guidelines.
  • When using the SMP100LC-35 in a high-reliability application, consider the device's failure modes and effects analysis (FMEA). Ensure that the device is operated within its specified parameters, and that the PCB is designed for high reliability. Use redundant systems or error correction mechanisms to mitigate the effects of device failure. Consult the datasheet and application notes for guidance on using the SMP100LC-35 in high-reliability applications.

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SMP100LC-35 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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