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SMP1325-085LF - Skyworks

Description: SMP1325-085LF: Surface-Mount PIN Diode for High-Power Switch Applications RF Diode PIN - Single 200V 200 mA 4.5 W 3-QFN (2x2) 500mOhm @ 100mA, 100MHz, -40°C ~ 150°C (TA)

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PCB Footprints
SMP1325-085LF - Skyworks PCB footprint - Other - Other - 3-QFN (2x2)
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3D Models
SMP1325-085LF - Skyworks  - 3D model - Other - 3-QFN (2x2)
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SMP1325-085LF Details

  • Manufacturer Part Number:

    SMP1325-085LF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    QFN

  • Package Description:

    2 X 2 MM, GREEN, QFN-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Skyworks Solutions Inc

  • YTEOL:

    0

  • Additional Feature:

    LOW DISTORTION

  • Application:

    ATTENUATOR; SWITCHING

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    0.65 pF

  • Diode Capacitance-Nom:

    0.56 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    0.5 Ω

  • Diode Res Test Current:

    100 mA

  • Diode Res Test Frequency:

    100 MHz

  • Diode Type:

    PIN DIODE

  • Frequency Band:

    HIGH FREQUENCY TO C BAND

  • JESD-30 Code:

    S-PDSO-C2

  • Minority Carrier Lifetime-Nom:

    5 µs

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    3 W

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

SMP1325-085LF Frequently Asked Questions (FAQs)

  • Skyworks provides a recommended PCB layout and land pattern in their application note AN-2025, which can be found on their website. It's essential to follow these guidelines to ensure optimal performance and minimize parasitic effects.
  • The SMP1325-085LF has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB. Ensure good thermal conductivity by using a thermal via or a thermal pad on the PCB, and consider using a heat sink or a thermal interface material if necessary.
  • The SMP1325-085LF is rated for operation from -40°C to +125°C, but it's essential to derate the power handling capability at higher temperatures to ensure reliability and prevent thermal runaway.
  • The SMP1325-085LF has a specific input and output impedance, which can be found in the datasheet. Use impedance matching networks or tuning components to match the impedance of your system to the device, ensuring maximum power transfer and minimal reflections.
  • The recommended biasing and control voltage for the SMP1325-085LF can be found in the datasheet. Typically, a voltage regulator or a biasing network is required to provide the necessary voltage and current to the device. Ensure that the biasing and control voltage are within the recommended range to ensure proper operation.

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SMP1325-085LF Overview

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