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SP1012-05WTG - LITTELFUSE

Description: 5CH 30KV 5V TVS Diode Array 0402WLCSP

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PCB Footprints
SP1012-05WTG - LITTELFUSE PCB footprint - Other - Other - 0.94x0.61mm Flip Chip
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3D Models
SP1012-05WTG - LITTELFUSE  - 3D model - Other - 0.94x0.61mm Flip Chip
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SP1012-05WTG Details

  • Manufacturer Part Number:

    SP1012-05WTG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.79

  • Breakdown Voltage-Min:

    6 V

  • Configuration:

    COMMON BIPOLAR TERMINAL, 5 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N6

  • Number of Elements:

    5

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SP1012-05WTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the SP1012-05WTG involves keeping the input and output traces separate, using a solid ground plane, and placing the TVS diode close to the input connector to minimize lead inductance.
  • To select the correct TVS diode, consider the maximum voltage, current, and power requirements of your application. The SP1012-05WTG is suitable for 5V systems with a maximum voltage of 12.5V and a peak pulse current of 5A.
  • The SP1012-05WTG has a response time of <1ns, making it suitable for high-speed applications where fast response times are critical.
  • The SP1012-05WTG is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to consider the derating curves and thermal management in your design.
  • To ensure reliability and longevity, follow proper PCB design and assembly guidelines, avoid overheating, and ensure the device is operated within its specified ratings and conditions.

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