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SP2502LBTG - LITTELFUSE

Description: ESD Suppressors / TVS Diodes 75A 30KV 3.3V Lightning Protection

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Symbol
SP2502LBTG - LITTELFUSE - PCB symbol
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PCB Footprints
SP2502LBTG - LITTELFUSE PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8
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3D Models
SP2502LBTG - LITTELFUSE - 3D model - Small Outline Packages - SOIC-8
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SP2502LBTG Details

  • Manufacturer Part Number:

    SP2502LBTG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    7.4

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Min:

    3.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Non-rep Peak Rev Power Dis-Max:

    2100 W

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

SP2502LBTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the SP2502LBTG involves keeping the input and output traces separate, using a solid ground plane, and minimizing the distance between the device and the protection components. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and place the device onto the PCB. Use a reflow oven or a hot air gun to solder the device, following the recommended reflow profile.
  • The SP2502LBTG is rated for operation from -40°C to 85°C. However, the device can tolerate short-term excursions up to 100°C during soldering or other manufacturing processes.
  • Yes, the SP2502LBTG is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is manufactured using automotive-grade processes.
  • To troubleshoot issues with the SP2502LBTG, start by verifying the power supply voltage and ensuring that the device is properly soldered onto the PCB. Check for any signs of physical damage or overheating. Use a multimeter to measure the voltage and current at the input and output pins. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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SP2502LBTG Overview

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