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SP3422-04UTG - LITTELFUSE

Description: 16.7V (Typ) Clamp 2A (8/20µs) Ipp Tvs Diode Surface Mount 5-DFN (1x0.6)

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PCB Footprints
SP3422-04UTG - LITTELFUSE PCB footprint - Other - Other - μDFN-5
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3D Models
SP3422-04UTG - LITTELFUSE  - 3D model - Other - μDFN-5
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SP3422-04UTG Details

  • Manufacturer Part Number:

    SP3422-04UTG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.44

  • Additional Feature:

    LOW CAPACITANCE, LOW LEAKAGE CURRENT

  • Clamping Voltage-Max:

    16.7 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N5

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SP3422-04UTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the SP3422-04UTG involves keeping the input and output traces separate, using a solid ground plane, and minimizing the distance between the device and the protection components. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and place the device onto the PCB. Use a reflow oven or a hot air gun to solder the device, following the recommended reflow profile.
  • The SP3422-04UTG is rated for operation from -40°C to 85°C. However, the device can tolerate short-term excursions up to 125°C during reflow soldering or other manufacturing processes.
  • Yes, the SP3422-04UTG is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is manufactured using automotive-grade processes.
  • To prevent ESD damage, handle the SP3422-04UTG with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the workspace and personnel are grounded, and avoid touching the device's pins or leads.

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SP3422-04UTG Overview

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