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SP370251160XTMA3 - Infineon

Description: Board Mount Pressure Sensors TPMS & INERTIA

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SP370251160XTMA3 Details

  • Manufacturer Part Number:

    SP370251160XTMA3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-14

  • ECCN Code:

    EAR99

  • HTS Code:

    9026.20.40.00

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Body Breadth:

    6.05 mm

  • Body Height:

    3.885 mm

  • Body Length or Diameter:

    11.09 mm

  • Housing:

    PLASTIC

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    10

  • Operating Current-Max:

    15 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Interface Type:

    I2C INTERFACE

  • Output Range:

    0.5-2.5V

  • Output Type:

    DIGITAL VOLTAGE

  • Package Shape/Style:

    RECTANGULAR

  • Port Type:

    HOLE

  • Pressure Range-Max:

    72.5 Psi

  • Pressure Range-Min:

    14.5 Psi

  • Sensors/Transducers Type:

    PRESSURE SENSOR,PIEZORESISTIVE

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.1 V

  • Surface Mount:

    YES

  • Termination Type:

    SOLDER

SP370251160XTMA3 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design and layout guidelines in their application notes and design guides. It's essential to follow these guidelines to ensure optimal thermal performance and minimize electromagnetic interference (EMI).
  • Consult Infineon's application notes and datasheet for specific biasing and configuration recommendations. Additionally, consider consulting with an experienced engineer or seeking support from Infineon's technical support team.
  • Monitor parameters such as voltage, current, and temperature. Implement over-voltage, under-voltage, and over-temperature protection mechanisms. Infineon provides guidance on fault detection and protection in their application notes and datasheet.
  • Follow Infineon's guidelines for PCB layout, component placement, and shielding. Implement proper grounding, decoupling, and filtering techniques to minimize EMI. Consult Infineon's application notes and EMC guidelines for more information.
  • Follow Infineon's storage and handling guidelines to prevent damage from electrostatic discharge (ESD), moisture, and physical stress. Store devices in their original packaging, and handle them with ESD-protective equipment and clothing.

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SP370251160XTMA3 Overview

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