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SP9M4GH1AHI11 - SMARTsemi

Description: 2GB, pSLC, eMMC 5.1, 153-FBGA, Industrial Temp

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Symbol

SP9M4GH1AHI11 - SMARTsemi - PCB symbol

PCB Footprints

SP9M4GH1AHI11 - SMARTsemi PCB footprint - BGA - BGA - 153-Ball BGA Dimensions – 11.5 mm x 13 mm x 0.8 mm

3D Models

SP9M4GH1AHI11 - SMARTsemi - 3D model - BGA - 153-Ball BGA Dimensions – 11.5 mm x 13 mm x 0.8 mm

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Stock & Prices Price & Stock for SP9M4GH1AHI11
Part Number SP9M4GH1AHI11
Manufacturer SMARTsemi
Pin Count 153
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 153-Ball BGA Dimensions – 11.5 mm x 13 mm x 0.8 mm
Released Date Nov 28, 2025
Last Modified Date Nov 28, 2025 4:17 AM UTC
Pinout / Pin List Click Here (Member Only)

SP9M4GH1AHI11 Details

Manufacturer Part Number:
SP9M4GH1AHI11
Manufacturer:
SmartSemi

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