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SPC21284 - Multicomp Pro

Description: SWITCH, TOGGLE, DPDT, 5A, 250V; Switch O

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PCB Footprints
SPC21284 - Multicomp Pro PCB footprint - Other - Other - SPC21284-2
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3D Models
SPC21284 - Multicomp Pro  - 3D model - Other - SPC21284-2
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SPC21284 Details

  • Manufacturer Part Number:

    SPC21284

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.50.70.00

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    8

  • Actuator Angle:

    25 deg

  • Actuator Length:

    0.41 inch

  • Actuator Material:

    BRASS

  • Actuator Type:

    TOGGLE

  • Body Breadth:

    12.7 mm

  • Body Height:

    10.414 mm

  • Body Length or Diameter:

    11.43 mm

  • Bushing Diameter:

    0.115 inch

  • Bushing Length:

    0.35 inch

  • Bushing Type:

    1/4-40

  • Center Contact Material:

    COPPER ALLOY

  • Center Contact Plating:

    SILVER

  • Contact Current(DC)-Max:

    5 A

  • Contact (DC) Max Rating R Load:

    5A@28VDC

  • Contact Function:

    ON-ON

  • Contact Resistance:

    0.01 mΩ

  • Contact Voltage(DC)-Max:

    28 V

  • Dielectric Withstand Volts:

    1000VRMS V

  • End Contact Material:

    COPPER ALLOY

  • End Contact Plating:

    SILVER

  • Housing Material:

    STAINLESS STEEL

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Material:

    DIALLYL PHTHALATE

  • Mounting Feature:

    PANEL MOUNT

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Sealing:

    EPOXY

  • Surface Mount:

    NO

  • Switch Function:

    DPDT

  • Switch Type:

    TOGGLE SWITCH

  • Terminal Length:

    0.096 inch

  • Terminal Material:

    COPPER ALLOY

  • Termination Type:

    SOLDER

SPC21284 Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the input and output traces separate, using a solid ground plane, and placing the device near a heat sink or thermal pad. A thermal management strategy should include a heat sink or thermal interface material to maintain a junction temperature below 125°C.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal management strategy, use a heat sink or thermal interface material, and ensure good airflow around the device. Additionally, consider using a thermally conductive adhesive or thermal tape to improve heat transfer.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially cause damage to the device. It's essential to operate the device within the specified voltage, current, and temperature ranges to ensure optimal performance and longevity.
  • To troubleshoot common issues, start by verifying the PCB layout and thermal management strategy. Check for proper input and output decoupling, ensure the device is operated within the recommended conditions, and verify the input voltage is within the specified range. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • To minimize EMI and EMC issues, follow proper PCB layout and design practices, such as using a solid ground plane, separating input and output traces, and using shielding or filtering components as necessary. Consult the datasheet and application notes for specific EMI and EMC guidelines.

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SPC21284 Overview

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