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SPC5121YVY400B - NXP

Description: 32-bit Microcontrollers - MCU TELEMATICS PROCESSOR

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SPC5121YVY400B - NXP - PCB symbol
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SPC5121YVY400B - NXP PCB footprint - BGA - BGA - bga 516 pin-+
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SPC5121YVY400B - NXP - 3D model - BGA - bga 516 pin-+
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SPC5121YVY400B Details

  • Manufacturer Part Number:

    SPC5121YVY400B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, TFBGA-516

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B516

  • JESD-609 Code:

    e4

  • Length:

    27 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    516

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA516,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.55 mm

  • Speed:

    400 MHz

  • Supply Voltage-Max:

    1.47 V

  • Supply Voltage-Min:

    1.33 V

  • Supply Voltage-Nom:

    1.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

SPC5121YVY400B Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management strategy in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, reliability, and thermal management.
  • To optimize for low power consumption, use the device's power-saving modes, reduce clock frequencies, and minimize unnecessary peripheral usage. Additionally, optimize the PCB design for thermal efficiency, and consider using thermal interface materials to reduce thermal resistance.
  • Use NXP's development tools, such as the SPC5-STUDIO or S32 Design Studio, which provide debugging and troubleshooting capabilities. Also, implement robust error handling and logging mechanisms in your firmware to facilitate debugging and troubleshooting.
  • Consult NXP's safety and security documentation, and follow the guidelines for implementing safety and security features, such as secure boot, encryption, and access control. Additionally, consider obtaining certifications from reputable organizations, such as ISO or IEC, to ensure compliance with industry standards.
  • Follow NXP's guidelines for EMC and EMI design considerations, including proper PCB layout, shielding, and filtering. Ensure that your design meets the relevant EMC and EMI standards, such as CISPR and FCC, for your target market and application.

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SPC5121YVY400B Overview

Use the download button to access the SPC5121YVY400B schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SPC51, or try a keyword search, such as Microprocessors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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