SPC5517EBMLQ66 - NXP

SPC5517EBMLQ66 Details

• Manufacturer Part Number:

  SPC5517EBMLQ66

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  LQFP-144

• Country Of Origin:

  Mainland China, Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  12 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• Has ADC:

  YES

• Address Bus Width:

  32

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  MPC5510

• Clock Frequency-Max:

  40 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• External Data Bus Width:

  32

• Format:

  FIXED POINT

• Integrated Cache:

  NO

• JESD-30 Code:

  S-PQFP-G144

• JESD-609 Code:

  e3

• Length:

  20 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  16

• Number of External Interrupts:

  1

• Number of I/O Lines:

  111

• Number of Serial I/Os:

  14

• Number of Terminals:

  144

• Number of Timers:

  8

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  NO

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFQFP

• Package Equivalence Code:

  QFP144,.87SQ,20

• Package Shape:

  SQUARE

• Package Style:

  FLATPACK, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  81920

• ROM (words):

  196608

• ROM Programmability:

  FLASH

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  1.6 mm

• Speed:

  66 MHz

• Supply Voltage-Max:

  5.25 V

• Supply Voltage-Min:

  4.5 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  20 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC