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SPC560P50L3CEFBR - STMicroelectronics

Description: 64 MHz, single issue, 32-bit CPU core complex (e200z0h) – Compliant with Power Architecture® embedded category – Variable Length Encoding (VLE) ■ Memory organization – Up to 512 KB on-chip code flash memory with ECC and erase/program controller – Additional 64 (4 × 16) KB on-chip data flash memory with ECC for EEPROM emulation – Up to 40 KB on-chip SRAM with ECC ■ Fail safe protection – Programmable watchdog timer – Non-maskable interrupt – Fault collection unit ■ Nexus L2+ interface ■ Inter

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SPC560P50L3CEFBR - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP-100
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SPC560P50L3CEFBR Details

  • Manufacturer Part Number:

    SPC560P50L3CEFBR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-100

  • Pin Count:

    100

  • Country Of Origin:

    Malta

  • ECCN Code:

    5A991.B.4.A

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Has ADC:

    YES

  • Address Bus Width:

    32

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    SPC56

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    25

  • Number of I/O Lines:

    67

  • Number of Terminals:

    100

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100(UNSPEC)

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    40960

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Speed:

    60 MHz

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SPC560P50L3CEFBR Frequently Asked Questions (FAQs)

  • The SPC560P50L3CEFBR can operate in a temperature range of -40°C to 125°C.
  • The clock settings can be configured using the Clock Generation Unit (CGU) module, which allows for flexible clock tree configuration. Refer to the device's reference manual for detailed instructions.
  • The maximum frequency of the CPU is 80 MHz.
  • The SPC560P50L3CEFBR has 512 KB of flash memory.
  • Yes, the SPC560P50L3CEFBR is an automotive-grade microcontroller, designed for use in automotive applications, and meets the requirements of the AEC-Q100 standard.

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SPC560P50L3CEFBR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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