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SPC5633MF1MLQ40 - NXP

Description: 32-bit Microcontrollers - MCU 1MFlash,64KRAM e200z33

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SPC5633MF1MLQ40 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP144 (SOT486-2)
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SPC5633MF1MLQ40 - NXP  - 3D model - Quad Flat Packages - LQFP144 (SOT486-2)
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SPC5633MF1MLQ40 Details

  • Manufacturer Part Number:

    SPC5633MF1MLQ40

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-144

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Address Bus Width:

    22

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    E200Z3

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    32

  • Number of External Interrupts:

    11

  • Number of I/O Lines:

    73

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    144

  • Number of Timers:

    2

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    65536

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Speed:

    40 MHz

  • Supply Current-Max:

    98 mA

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SPC5633MF1MLQ40 Frequently Asked Questions (FAQs)

  • The SPC5633MF1MLQ40 can operate from -40°C to 125°C, but the recommended operating temperature range is -40°C to 105°C.
  • The clock settings for the SPC5633MF1MLQ40 can be configured using the Clock Generation Module (CGM) and the Power Management Module (PMM). Refer to the device's reference manual for detailed instructions.
  • The maximum frequency for the CPU is 264 MHz, and the maximum frequency for the peripherals is 132 MHz.
  • The SPC5633MF1MLQ40 has a built-in Secure Boot mechanism that uses a combination of hardware and software components to ensure the authenticity and integrity of the boot process. Refer to the device's security manual for detailed instructions.
  • The power consumption of the SPC5633MF1MLQ40 varies depending on the operating mode and frequency. In active mode, the typical power consumption is around 250 mA at 264 MHz. In sleep mode, the typical power consumption is around 10 mA.

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SPC5633MF1MLQ40 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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