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SPC5775BDK3MME2R - NXP

Description: IC MCU 32BIT 4MB FLASH 416MAPBGA

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PCB Footprints
SPC5775BDK3MME2R - NXP PCB footprint - BGA - BGA - 416-ball MAPBGA_2020
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3D Models
SPC5775BDK3MME2R - NXP  - 3D model - BGA - 416-ball MAPBGA_2020
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SPC5775BDK3MME2R Details

  • Manufacturer Part Number:

    SPC5775BDK3MME2R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Time@Peak Reflow Temperature-Max (s):

    40

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SPC5775BDK3MME2R Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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