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SPC5775EDK3MME3 - NXP

Description: MCU 32-bit e200z7 RISC 4MB Flash 5V Automotive 416-Pin MAP-BGA Tray

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PCB Footprints
SPC5775EDK3MME3 - NXP PCB footprint - BGA - BGA - 416-ball MAPBGA_2020
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3D Models
SPC5775EDK3MME3 - NXP  - 3D model - BGA - 416-ball MAPBGA_2020
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SPC5775EDK3MME3 Details

  • Manufacturer Part Number:

    SPC5775EDK3MME3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Time@Peak Reflow Temperature-Max (s):

    40

SPC5775EDK3MME3 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the SPC5775EDK3MME3 is -40°C to 125°C.
  • The clock settings for the SPC5775EDK3MME3 can be configured using the Clock Management Unit (CMU) registers. Refer to the device's reference manual for detailed information on clock configuration.
  • The maximum frequency of the SPC5775EDK3MME3 is 320 MHz.
  • Secure boot on the SPC5775EDK3MME3 can be implemented using the device's Boot Assist Module (BAM) and a secure boot loader. Refer to the device's reference manual and NXP's secure boot documentation for detailed information.
  • The SPC5775EDK3MME3 has 3.5 MB of on-chip RAM.

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SPC5775EDK3MME3 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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