SPC5777CK3MME3 - NXP

SPC5777CK3MME3 Details

• Manufacturer Part Number:

  SPC5777CK3MME3

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  MAPBGA-416

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  12 Weeks

• Date Of Intro:

  2016-03-08

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  8.08

• Has ADC:

  YES

• Additional Feature:

  ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  E200Z7

• Clock Frequency-Max:

  40 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• Format:

  FLOATING-POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B416

• JESD-609 Code:

  e2

• Length:

  27 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  128

• Number of External Interrupts:

  1

• Number of Serial I/Os:

  5

• Number of Terminals:

  416

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA416,26X26,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  260

• RAM (bytes):

  524288

• ROM (words):

  8388608

• ROM Programmability:

  FLASH

• Seated Height-Max:

  2.02 mm

• Speed:

  264 MHz

• Supply Current-Max:

  1350 mA

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  27 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC