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SPM5030VT-R33M-D - TDK

Description: Inductors for power circuits, Wound metal, Automotive

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SPM5030VT-R33M-D - TDK PCB footprint - Other - Other - SPM5030VT
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SPM5030VT-R33M-D - TDK  - 3D model - Other - SPM5030VT
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SPM5030VT-R33M-D Details

  • Manufacturer Part Number:

    SPM5030VT-R33M-D

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    3

  • Case/Size Code:

    2120

  • Construction:

    Rectangular

  • Core Material:

    METAL CORE

  • DC Resistance:

    0.0042 Ω

  • Inductance-Nom (L):

    0.33 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    3 mm

  • Package Length:

    5.3 mm

  • Package Style:

    SMT

  • Package Width:

    5.1 mm

  • Packing Method:

    TR, Embossed Plastic, 13 Inch

  • Rated Current-Max:

    14.2 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DCR IS MEASURED AT 10 % TOLERANCE

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SPM5030VT-R33M-D Frequently Asked Questions (FAQs)

  • The recommended land pattern for SPM5030VT-R33M-D can be found in the TDK Corporation's application note or footprint recommendation document, which provides detailed information on the recommended pad layout, size, and spacing for optimal performance and reliability.
  • Thermal management is critical for the SPM5030VT-R33M-D. It's recommended to use a thermal pad or thermal interface material (TIM) to improve heat dissipation. The device should be mounted on a heat sink or a metal core PCB to reduce thermal resistance. Additionally, ensure good airflow around the device to prevent overheating.
  • The maximum operating temperature range for SPM5030VT-R33M-D is -40°C to +125°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures, and derating may be necessary for high-temperature applications.
  • The SPM5030VT-R33M-D is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to use additional mechanical support, such as a bracket or a clamp, to ensure the device remains securely attached to the PCB. Consult with TDK Corporation or a qualified engineer for specific guidance on vibration testing and mitigation.
  • To ensure the reliability of SPM5030VT-R33M-D in high-humidity environments, it's recommended to use conformal coating, potting, or encapsulation to protect the device from moisture. Additionally, ensure the PCB is designed with moisture-resistant materials and follows proper humidity-resistant design practices.

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SPM5030VT-R33M-D Overview

Use the download button to access the SPM5030VT-R33M-D schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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